micro chip scanning

Fumax Tech nfunni awọn Boomọ Circuit Titẹjade ti o ga julọ (PCB) pẹlu PCB pupọ-fẹlẹfẹlẹ (ọkọ atẹjade atẹjade), ipele HDI giga (asopọ asopọ iwuwo giga), Layer PCB lainidii ati PCB rirọ-rirọ… ati be be lo.

Gẹgẹbi ohun elo ipilẹ, Fumax loye pataki ti didara igbẹkẹle ti PCB. A ṣe idoko-owo si awọn ẹrọ ti o dara julọ ati ẹgbẹ abinibi lati ṣe awọn igbimọ didara to dara julọ.

Awọn ẹka PCB aṣoju wa ni isalẹ.

Kosemi PCB

Rọ & Kosemi Flex PCBs

HDI PCB

Ga Igbohunsafẹfẹ PCB

Ga TG PCB

LED PCB

Irin mojuto PCB

Nipọn Cooper PCB

Aluminiomu PCB

 

Awọn agbara iṣelọpọ wa ni a fihan ninu chart ti o wa ni isalẹ.

Iru

Agbara

Dopin

Awọn pupọ pupọ (4-28) I HDI (4-20) Flex 、 Rigid Flex

Ipa Meji

CEM-3 、 FR-4 、 Rogers RO4233 、 Bergquist Gbona Clad 4mil – 126mil (0.1mm-3.2mm)

Awọn elere pupọ

4-28 fẹlẹfẹlẹ, ọkọ sisanra 8mil-126mil (0.2mm-3.2mm)

Sin / Afọju Nipasẹ

4-20 fẹlẹfẹlẹ, ọkọ sisanra 10mil-126mil (0.25mm-3.2mm)

HDI

1 + N + 1、2 + N + 2、3 + N + 3 、 Eyikeyi fẹlẹfẹlẹ

Flex & Kosemi-Flex PCB

1-8layers Flex PCB, 2-12layers Ridid-flex PCB HDI + Rigid-flex PCB

Laminate

 

Iru Soldermask (LPI)

Taiyo 、 Goo's 、 Probimer FPC .....

Peelable Soldermask

 

Inki erogba

 

HASL / Ṣiṣakoso HASL ọfẹ

Ọra: 0.5-40um

OSP

 

ENIG (Ni-Au)

 

Ni-Au elekitiro-bondable

 

Electro-nickel palladium Ni-Au

Au: 0.015-0.075um Pd 0.02-0.075um Ni: 2-6umm

Itanna Gull lile

 

Nkan ti o nipọn

 

Agbara

Ibi iṣelọpọ

Min darí Iho Iho

0.20mm

Min. Lesa lu Iho

4 milimita (0.100mm)

Line iwọn / aye

2mil / 2mil

Max. Iwon Panel

21.5 "X 24.5" (546mm X 622mm)

Line iwọn / aye ifarada

Aṣọ itanna ti kii ṣe: +/- 5um coating Ideri itanna: +/- 10um

PTH Iho Ifarada

+/- 0.002inch (0.050mm)

NPTH Iho Ifarada

+/- 0.002inch (0.050mm)

Iho Ifarada Ipo

+/- 0.002inch (0.050mm)

Iho si eti ifarada

+/- 0.004inch (0.100mm)

Eti to Edidi Ifarada

+/- 0.004inch (0.100mm)

Ipele si Ifarada Layer

+/- 0.003inch (0.075mm)

Agbara ifarada

+/- 10%

Oju-iwe%

Max≤0.5%

Imọ-ẹrọ (Ọja HDI)

NIPA

Gbóògì

Lesa Nipasẹ liluho / paadi

0,125 / 0,30 、 0,125 / 0,38

Afọju Nipasẹ liluho / paadi

0,25 / 0,50

Line iwọn / aye

0,10 / 0,10

Ibiyi Iho

CO2 Lesa Direct lu

Kọ Ohun elo

FR4 LDP (LDD); RCC 50 ~ 100 micron

Cu Sisanra lori Iho Odi

Iho Afọju: 10um (min)

Ipin ratio

0.8: 1

Imọ-ẹrọ (PCB Rọ)

Ise agbese 

Agbara

Yi lọ lati yiyi (ẹgbẹ kan)

BẸẸNI

Yi lọ lati yiyi (lẹẹmeji)

Rara

Iwọn didun lati yipo iwọn ohun elo mm 

250

Iwọn iṣelọpọ to kere julọ mm 

250x250 

Iwọn iṣelọpọ to pọ julọ mm 

500x500 

Alemo Apejọ SMT (Bẹẹni / Bẹẹkọ)

BẸẸNI

Agbara Gap Air (Bẹẹni / Bẹẹkọ)

BẸẸNI

Ṣiṣẹjade ti awo abuda lile ati rirọ (Bẹẹni / Bẹẹkọ)

BẸẸNI

Max fẹlẹfẹlẹ (Lile)

10

Layer ti o ga ju (Awo tutu)

6

Ohun elo Imọ 

 

PI

BẸẸNI

Ọsin

BẸẸNI

Ejò itanna

BẸẸNI

Yiyi Anneal Ejò Bankanje

BẸẸNI

PI

 

Ibora ifarada tito fiimu mm

± 0,1 

Iwọn fiimu ti o kere ju mm

0.175

Imudara 

 

PI

BẸẸNI

FR-4

BẸẸNI

SUS

BẸẸNI

EMI IKU

 

Inki Fadaka

BẸẸNI

Fiimu Fadaka

BẸẸNI